Resinlab® SEC1244 Silver Filled Epoxy Adhesive

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Resinlab® SEC1244 Silver Filled Epoxy Adhesive
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	Resinlab™ SEC1244 is a silver filled, two component, elevated temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications. It is a smooth 100% solids thixotropic solvent free paste provided in a 1:1 weight ratio. This product can cure very quickly at high temperatures. 5 minutes at 150°C, 15 minutes at 120°C or 60 minutes at 100°C can be used as guides to determining optimum processing conditions. SEC1244 provides the additional benefit of very high thermal conductivity due to its high loading of pure silver. Alloys are not used as they have been proven to be less reliable. It gives good environmental protection while having tenacious adhesion to various metals and other common assembly materials. Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
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Physical Properties	Original Value	Comments

Specific Gravity	3.90 g/cc	Mixed; TM R050-16
Water Absorption	<= 0.20 % @Time 86400 sec	TM R050-35
Viscosity	298000 cP @Shear Rate 1.00 1/s	Mixed

Mechanical Properties	Original Value	Comments
Hardness, Shore D	90
Tensile Strength at Break	5000 psi	TM R050-36
Tensile Strength, Ultimate	5000 psi	TM R050-36
Tensile Strength, Yield	3500 psi	TM R050-36
Elongation at Break	1.0 - 2.0 %	TM R050-36
Tensile Modulus	600 ksi	TM R050-36
Compressive Yield Strength	10500 psi	TM R050-38
Compressive Strength	12500 psi	Break; TM R050-38
	13500 psi	Ultimate; TM R050-38
Compressive Modulus	750 ksi	TM R050-38
Adhesive Bond Strength	500 psi	Lap Shear-Aluminum

Electrical Properties	Original Value	Comments
Volume Resistivity	0.00060 ohm-cm

Thermal Properties	Original Value	Comments
CTE, linear	40.0 µm/m-°C @Temperature <=98.0 °C	Below Tg
Thermal Conductivity	3.00 W/m-K
Maximum Service Temperature, Air	150 °C
Minimum Service Temperature, Air	-40.0 °C
Glass Transition Temp, Tg	98.0 °C

Processing Properties	Original Value	Comments
Cure Time	5.00 min @Temperature 150 °C
	60.0 min @Temperature 100 °C
Pot Life	>= 240 min

Descriptive Properties
Appearance	silver paste
Mix Ratio by Volume	1:1
Side-By-Side Cartridges Capable	No

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Lead, Pb

PRESL173 / 101587

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