| Resinlab™ SEC1244 is a silver filled, two component, elevated temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications. It is a smooth 100% solids thixotropic solvent free paste provided in a 1:1 weight ratio. This product can cure very quickly at high temperatures. 5 minutes at 150°C, 15 minutes at 120°C or 60 minutes at 100°C can be used as guides to determining optimum processing conditions. SEC1244 provides the additional benefit of very high thermal conductivity due to its high loading of pure silver. Alloys are not used as they have been proven to be less reliable. It gives good environmental protection while having tenacious adhesion to various metals and other common assembly materials.Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company. |
