Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping

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Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive
Material Notes:	Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency. In addition to the high electrical conductivity, the short curing cycles, the proven reliability, and the convenient mix ratio, EPO-TEK® H20S is extremely simple to use. Advantages & Application Notes: Especially recommended for use in high speed epoxy chip bonding systems where fast cures are highly desirable. Suggested for JEDEC Level III and II plastic IC packaging. The low temperature cure makes it ideal for flex circuitry and other low stress applications. It is used extensively for bonding quartz crystal oscillators and other stress sensitive chips. Used for die and SMD bonding inside hybrid/hermetic packages such as DIP and TO-Cans; also EMI/Rf shielding of micro-electronics. Ideal for making ITO electrical contacts in LCD packaging; and suggested for LED die-attach. Information Provided by Epoxy Technology
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Physical Properties	Metric	English	Comments

Specific Gravity	1.74 g/cc	1.74 g/cc	Part A
	3.07 g/cc	3.07 g/cc	Part B
Particle Size	<= 20 µm	<= 20 µm
Viscosity	1800 - 2800 cP @Temperature 23.0 °C	1800 - 2800 cP @Temperature 73.4 °F	100 rpm

Chemical Properties	Metric	English	Comments
Ionic Impurities - Na (Sodium)	0.00 ppm	0.00 ppm
Ionic Impurities - K (Potassium)	4.0 ppm	4.0 ppm
Ionic Impurities - Cl (Chloride)	162 ppm	162 ppm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	64	64
Tensile Modulus	2.3423 GPa	339.72 ksi	Storage
Shear Strength	8.55 MPa	1240 psi	Lap
	>= 11.7 MPa	>= 1700 psi	Die

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm

Thermal Properties	Metric	English	Comments
CTE, linear	31.0 µm/m-°C	17.2 µin/in-°F	Below Tg
	120 µm/m-°C	66.7 µin/in-°F	Above Tg
Thermal Conductivity	3.25 W/m-K	22.6 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	200 °C	392 °F	Continuous
	300 °C	572 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 80.0 °C	>= 176 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	414 °C	777 °F	Degradation Temperature

Processing Properties	Metric	English	Comments
Cure Time	0.750 min @Temperature 175 °C	0.0125 hour @Temperature 347 °F	Minimum Bond Line
	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F	Minimum Bond Line
	15.0 min @Temperature 120 °C	0.250 hour @Temperature 248 °F	Minimum Bond Line
	45.0 min @Temperature 100 °C	0.750 hour @Temperature 212 °F	Minimum Bond Line
Pot Life	4320 min	4320 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties
Color	Silver		Part A
	Silver		Part B
Consistency	Smooth thixotropic paste
Ionic Impurities NH₄	82 ppm
Mix Ratio by Weight	1:1
Number of Components	Two
Thixotropic Index	5
Weight Loss	0.4%		200°C
	0.6%		250°C
	1.37%		300°C

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PPOXYT037 / 141076

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