Epoxy Technology EPO-TEK® 301-2FL Low Stress, Optical Epoxy

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USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

Epoxy Technology EPO-TEK® 301-2FL Low Stress, Optical Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Product Description: EPO-TEK® 301-2FL is a two component optical, medical, and semiconductor grade epoxy resin. It is a more flexible version of EPO-TEK® 301-2. Advantages & Application Notes: Suggested for LCD optical lamination and sealing of glass plates. The product can resist yellowing over 17 days of continuous UV light exposure. Suitable for LED encapsulation. Ease of use: potting and casting, encapsulation, and adhesive. Semiconductor applications: underfill for flip chips, glob top encapsulation over wire bonds, spin coating at wafer level. Compliant adhesive that will be resistant to impact or vibrations. Low stress adhesive for bonding optics inside OEM / scientific instruments. Fiber optic adhesive; bundling fibers, terminating fiber into ferrule, adhesive for mounting optics inside fiber components, bonding glass cover slip over V-groove; spectral transmission of visible and IR light. BIOCOMPATIBLE and NON-TOXIC; complies with USP Class VI biocompatibility standards for medical devices and implantation applications. Adhesion to glass, quartz, metals, wood and most plastics is very good. May also be used for impregnating wooden or porous objects for artifact restoration. Capable of both heat cure and room temperature cure. Information Provided by Epoxy Technology
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Physical Properties	Metric	English	Comments

Specific Gravity	0.890 g/cc	0.890 g/cc	Part B
	1.06 g/cc	1.06 g/cc	Part A
Viscosity	100 - 200 cP @Temperature 23.0 °C	100 - 200 cP @Temperature 73.4 °F	100 rpm

Chemical Properties	Metric	English	Comments
Ionic Impurities - Na (Sodium)	58 ppm	58 ppm
Ionic Impurities - K (Potassium)	19 ppm	19 ppm
Ionic Impurities - Cl (Chloride)	105 ppm	105 ppm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	70	70
Tensile Modulus	1.05 GPa	153 ksi	Storage
Shear Strength	>= 13.8 MPa	>= 2000 psi	Lap
	>= 23.4 MPa	>= 3400 psi	Die

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 6.00e+11 ohm-cm	>= 6.00e+11 ohm-cm
Dielectric Constant	3.54 @Frequency 1000 Hz	3.54 @Frequency 1000 Hz
Dissipation Factor	0.013 @Frequency 1000 Hz	0.013 @Frequency 1000 Hz

Thermal Properties	Metric	English	Comments
CTE, linear	56.0 µm/m-°C	31.1 µin/in-°F	Below Tg
	211 µm/m-°C	117 µin/in-°F	Above Tg
Maximum Service Temperature, Air	150 °C	302 °F	Continuous
	250 °C	482 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 45.0 °C	>= 113 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	325 °C	617 °F	Degradation Temperature

Optical Properties	Metric	English	Comments
Refractive Index	1.5115 @Wavelength 589 nm	1.5115 @Wavelength 589 nm	uncured
Transmission, Visible	>= 97 % @Wavelength 1000 - 1600 nm	>= 97 % @Wavelength 1000 - 1600 nm	Spectral
	>= 99 % @Wavelength 400 - 1000 nm	>= 99 % @Wavelength 400 - 1000 nm	Spectral

Processing Properties	Metric	English	Comments
Cure Time	180 min @Temperature 80.0 °C	3.00 hour @Temperature 176 °F
	4320 min @Temperature 23.0 °C	72.0 hour @Temperature 73.4 °F
Pot Life	600 min	600 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Compliance Properties	Metric	English	Comments
USP Class VI	Yes	Yes

Descriptive Properties
Color	Clear/Colorless		Part A
	Clear/Colorless		Part B
Consistency	Pourable liquid
Ionic Impurities NH₄	8 ppm
Mix Ratio by Weight	100:35
Number of Components	Two
Weight Loss	0.5%		200°C
	0.96%		250°C
	3.52%		300°C

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PPOXYT108 / 141147

USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

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