| Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. Advantages & Application Notes: - Thixotropic paste allows for application by stencil or screen printing. SMD caps and resistors as small as the 0402 format have been mounted to PCB without silver bridging between the 2 electrodes.
- Capable of adhering to PCB metals like Au, Cu, OSP / Cu, Ag, Ag-Pd.
- Used for making electrical connections to PZT electrodes in ink-jetting or medical / ultrasound applications
- Suitable for low temperature flip chip packaging. “Bumps” of E2101 may be used instead of Sn/Pb solder balls.
- Suited for high speed automated syringe dispensing techniques.
- Low flow, low resin bleedout on gold surfaces.
- Passes NASA low outgassing standard ASTM E595 with proper cure
- JEDEC Level III and II semiconductor packaging materialInformation Provided by Epoxy Technology
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