| Description: Parker Chomerics fully cured dispensable GELs eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. These products require no mixing or curing, providing superior design flexibility. Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders: Lower temperature increases product life, typically a doubling of life based on every 10°C decrease in temperature; Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures. Typical Applications: Automotive Electronic Control Units (ECU’s), Power Supplies & Semiconductors, Memory & Power Modules, Microprocessors/Graphics Processors, and Flat Panel Displays & Consumer Electronics. Features/Benefits: Easily dispensable, Fully-cured/No pump out, High bulk thermal conductivity, Low thermal impedance, Ultra low compression force, High tack surface & reworkable and Proven long-term reliability. Product Attributes: Accommodates a variety of bond line thicknesses for application to multiple devices, Moderate bondline gel (approximately 4-40+ mils), High bulk thermal conductivity, Excellent performance-to-price, Compatible with high volume, automated dispense processes, and Meets Telcordia (Bellcore) silicone specifications. Information provided by Chomerics |
