Thermal Ceramics 1302 Board and Shapes Molded Min-K Insulation

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Thermal Ceramics 1302 Board and Shapes Molded Min-K Insulation
Categories:	Ceramic
Material Notes:	Min-K 1302 is a microporous material specifically designed to be molded into block and machined to specific customer designs. Min-K 1302 can also be supplied in blocks or boards. Features: Microporous Low thermal conductivity Compression resistant Machined to customer specification Lightweight Organic Applications: Aerospace High temperature Thermoelectric devices Instrumentation and analytical equipment Information provided by Thermal Ceramics Data has not been recently verified. Please contact manufacturer for current information.
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Physical Properties	Metric	English	Comments

Density	0.320 g/cc	0.0116 lb/in³

Mechanical Properties	Metric	English	Comments
Transverse Strength	>= 0.379 MPa	>= 55.0 psi
Compressive Yield Strength	0.758 MPa	110 psi	5% compression
	1.31 MPa	190 psi	8% compression

Thermal Properties	Metric	English	Comments
Specific Heat Capacity	0.962 J/g-°C @Temperature 204 °C	0.230 BTU/lb-°F @Temperature 400 °F
	1.05 J/g-°C @Temperature 427 °C	0.250 BTU/lb-°F @Temperature 800 °F
	1.13 J/g-°C @Temperature 649 °C	0.270 BTU/lb-°F @Temperature 1200 °F
	1.13 J/g-°C @Temperature 871 °C	0.270 BTU/lb-°F @Temperature 1600 °F
Thermal Conductivity	0.0288 W/m-K @Temperature 149 °C	0.200 BTU-in/hr-ft²-°F @Temperature 300 °F
	0.0317 W/m-K @Temperature 204 °C	0.220 BTU-in/hr-ft²-°F @Temperature 400 °F
	0.0331 W/m-K @Temperature 316 °C	0.230 BTU-in/hr-ft²-°F @Temperature 600 °F
	0.0360 W/m-K @Temperature 427 °C	0.250 BTU-in/hr-ft²-°F @Temperature 800 °F
	0.0389 W/m-K @Temperature 538 °C	0.270 BTU-in/hr-ft²-°F @Temperature 1000 °F
	0.0533 W/m-K @Temperature 649 °C	0.370 BTU-in/hr-ft²-°F @Temperature 1200 °F
	0.0749 W/m-K @Temperature 871 °C	0.520 BTU-in/hr-ft²-°F @Temperature 1600 °F
Maximum Service Temperature, Air	982 °C	1800 °F
Shrinkage	0.50 % @Temperature 982 °C, Time 14400 sec	0.50 % @Temperature 1800 °F, Time 4.00 hour

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CTHERM207 / 2527

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