SunChemical Gwent C2020509D1 Copper Ink

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SunChemical Gwent C2020509D1 Copper Ink (discontinued **)
Categories:	Fluid; Metal; Electronic/Magnetic Alloy; Other Engineering Material; Ceramic/Metallic Coating
Material Notes:	C2020509D1 is designed for BME End Terminations. The ink is designed for application using a Palomer dipping system. It can be used for Chipstar dippers, but the rheology needs of the customer have to be defined. It has excellent cosmetics and fires to a dense, smooth termination with high bond strength. It is designed to be used with standard Nickel/Tin Plating Systems. This Ink has been made at a ready to use viscosity and should be gently stirred before use avoiding introduction of air bubbles. Information provided by Gwent Electronic Materials Ltd.
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Physical Properties	Metric	English	Comments

Density	3.00 g/cc	0.108 lb/in³
Solids Content	74 - 76 %	74 - 76 %
Viscosity	10400 cP @Shear Rate 230 1/s, Temperature 25.0 °C	10400 cP @Shear Rate 230 1/s, Temperature 77.0 °F	Haake VT550 cone and plate viscometer with the PK1.1°
Brookfield Viscosity	33125 cP @Temperature 25.0 °C	33125 cP @Temperature 77.0 °F	10 rpm
Storage Temperature	20.0 °C	68.0 °F

Processing Properties	Metric	English	Comments
Processing Temperature	150 °C	302 °F
Dry Time	0.25 hour	0.25 hour	with air flow

Descriptive Properties
Cosmetics	Excellent
Plateability	Excellent
Solderability	Excellent

**
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