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Chemically Resistant adhesives

Parker Chomerics THERM-A-GAP™ GEL T630G Dispensable, Very Low Compression Force, Thermal Gap Filler
Categories: Polymer; Thermoset; Silicone

Material Notes: Description: THERM-A-GAP™ Gels are highly conformable, pre-cured, single-component compounds. The cross-linked gel structure provides superior long therm thermal stability and reliable performance. These unique materials result in much lower mechanical stress on delicate components than even the softest gap-filling sheets. They are ideal for filling variable gaps between multiple components and a common heat sink.

Features/Benefits: Dispensable; Fully cured; Highly conformable at low pressures; No refrigeration, mixing or filler settling issues in storage; Single dispensable TIM can eliminate multiple pad part sizes/numbers; RoHS Compliant and Reworkable

Typical Applications: Automotive electronic control unites (ECUs), engine control, transmission control, braking/traction control; Power conversion equipment; Power supplies and uninterruptible power supplies; Power semiconductors; MOSFET arrays with common heat sinks and Televisions and consumer electronics.

Product Attributes: Years of proven reliability in high-volume automotive applications; General use material; Good thermal performance; Lowest deflection force required; Minimal stress on components and “G” version has 0.010” glass beads as compression stops for electrical isolation.

Information provided by Chomerics

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 2.25 g/cc2.25 g/ccASTM D792
Thickness 250 microns9.84 milBondline
Deformation  36 %
@Thickness 2.54 mm,
Pressure 0.00689 MPa
36 %
@Thickness 0.100 in,
Pressure 1.00 psi
Dispensed 1.0 cc of material Brought 1" x 1" probe, Test rate 0.025 in/min; Modified ASTM C165
 47 %
@Thickness 2.54 mm,
Pressure 0.0138 MPa
47 %
@Thickness 0.100 in,
Pressure 2.00 psi
Dispensed 1.0 cc of material Brought 1" x 1" probe, Test rate 0.025 in/min; Modified ASTM C165
 54 %
@Thickness 2.54 mm,
Pressure 0.0207 MPa
54 %
@Thickness 0.100 in,
Pressure 3.00 psi
Dispensed 1.0 cc of material Brought 1" x 1" probe, Test rate 0.025 in/min; Modified ASTM C165
 59 %
@Thickness 2.54 mm,
Pressure 0.0276 MPa
59 %
@Thickness 0.100 in,
Pressure 4.00 psi
Dispensed 1.0 cc of material Brought 1" x 1" probe, Test rate 0.025 in/min; Modified ASTM C165
 63 %
@Thickness 2.54 mm,
Pressure 0.0345 MPa
63 %
@Thickness 0.100 in,
Pressure 5.00 psi
Dispensed 1.0 cc of material Brought 1" x 1" probe, Test rate 0.025 in/min; Modified ASTM C165
Outgassing - Total Mass Loss 0.55 %0.55 %ASTM E595
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+14 ohm-cm1.00e+14 ohm-cmASTM D257
Dielectric Constant 5.5
@Frequency 1e+6 Hz
5.5
@Frequency 1e+6 Hz
ASTM D150
Dielectric Strength 5.00 kV/mm127 kV/inASTM D149
Dissipation Factor 0.010
@Frequency 1e+6 Hz
0.010
@Frequency 1e+6 Hz
Chomerics
 
Thermal PropertiesMetricEnglishComments
CTE, linear 350 µm/m-°C194 µin/in-°FASTM E831
Specific Heat Capacity 1.10 J/g-°C0.263 BTU/lb-°FASTM D1269
Thermal Conductivity 0.700 W/m-K4.86 BTU-in/hr-ft²-°FASTM D5470
Maximum Service Temperature, Air 200 °C392 °F
Minimum Service Temperature, Air -55.0 °C-67.0 °F
Flammability, UL94 V-0V-0
 
Processing PropertiesMetricEnglishComments
Shelf Life 18.0 Month18.0 MonthFrom date of manufacture; Chomerics
 
Descriptive Properties
ColorWhite
Flow Rate10 cc/min30cc taper tip, 0.13" orifice, 90 psi; Chomerics

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PCHOME300 / 131010

Chemically Resistant adhesives

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