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Elmet Technologies

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Arlon Electronic Materials 25FR Low-Cost Ceramic Hydrocarbon
Categories: Polymer; Thermoset

Material Notes: High Frequency, Low Loss Thermoset Laminate and Prepreg for Double-sided, Multilayer and Mixed Dielectric Printed Circuit Boards

  • Low loss ceramic-filled thermoset resin
  • Tight dielectric tolerance control
  • Excellent dimensional stability
  • Excellent price/performance ratio

Benefits:

  • Greater signal integrity
  • Wider eye patterns
  • Excellent dimensional stability
  • Utilizes standard FR-4 processes
  • Excellent thermal properties

Typical Applications:

  • Cellular Base Station Antennas, Power Amplifiers, Down Converters
  • High Speed Backplanes

Information provided by ARLON Electronic Materials.

Vendors: Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets.

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Physical PropertiesOriginal ValueComments
Density 1.80 g/ccASTM D792 Method A
Water Absorption 0.090 %IPC TM-650 2.6.2.1
Thickness 3.90 milPrepreg thickness - glass style 1080
 5.80 milPrepreg thickness - glass style 2112
 6.70 milPrepreg thickness - glass style 2313
Outgassing - Total Mass Loss 0.070 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
Water Vapor Recovered; ASTM E595-90
 0.24 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
ASTM E595-90
Collected Volatile Condensable Material 0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
ASTM E595-90
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 14000 psiASTM D882
Flexural Strength 35.024 ksiASTM D790
Peel Strength 5.00 pliAfter Thermal Stress; IPC TM-650 2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 4.17e+14 ohm-cmCondition A; IPC TM-650 2.5.17.1
Surface Resistance 8.90e+14 ohmCondition A; IPC TM-650 2.5.17.1
Dielectric Constant 3.58
@Frequency 1e+10 Hz
C23/50; IPC TM-650 2.5.5.5
Dissipation Factor 0.0035
@Frequency 1e+10 Hz
C23/50; IPC TM-650 2.5.5.5
 
Thermal PropertiesOriginal ValueComments
CTE, linear 16.0 µm/m-°Cx, before Tg; IPC TM-650 2.4.24
 18.0 µm/m-°Cy, before Tg; IPC TM-650 2.4.24
CTE, linear, Transverse to Flow 59.0 µm/m-°Cz, before Tg; IPC TM-650 2.4.24
Thermal Conductivity 0.450 W/m-K
@Temperature 100 °C
ASTM E1225
Flammability, UL94 V-0
 
Descriptive Properties
Temperature Coefficient of Dielectric (ppm/°C)50IPC TM-650 2.5.5.5 adapted (-10 - 140°C)

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