High Frequency, Low Loss Thermoset Laminate and Prepreg for Double-sided, Multilayer and Mixed Dielectric Printed Circuit Boards- Low loss ceramic-filled thermoset resin
- Tight dielectric tolerance control
- Excellent dimensional stability
- Excellent price/performance ratio
Benefits: - Greater signal integrity
- Wider eye patterns
- Excellent dimensional stability
- Utilizes standard FR-4 processes
- Excellent thermal properties
Typical Applications: - Cellular Base Station Antennas, Power Amplifiers, Down Converters
- High Speed Backplanes
Information provided by ARLON Electronic Materials. |