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Chemically Resistant adhesives

Rogers Corporation RO4835 Hydrocarbon Ceramic Laminate, Improved Oxidation Resistance
Categories: Polymer; Thermoset

Material Notes: Features and Benefits:
  • Significantly improved oxidation resistance compared to typical thermoset microwave materials
  • Designed for performance sensitive, high volume applications
  • Low loss - Excellent electrical performance allows application with higher operating frequencies
  • Tight dielectric constant tolerance - Controlled impedance transmission lines
  • Lead free process compatible - no blistering or delamination
  • Low Z-axis expansion - reliable plated through holes
  • Low in-plane expansion coefficient - Remains stable over an entire range of circuit processing temperatures

Typical Applications:

  • Automotive radar sensors
  • Point-to point microwave
  • Power amplifiers
  • Phased - Array Radar
  • RF Components

Information provided by Rogers Corporation.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.92 g/cc0.0694 lb/in³ASTM D792
Moisture Absorption at Equilibrium 0.050 %
@Temperature 50.0 °C,
Time 173000 sec
0.050 %
@Temperature 122 °F,
Time 48.0 hour
immersion; 0.06 in thick; ASTM D570
Thickness 168 - 1520 microns6.60 - 60.0 milRange of available thicknesses
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 136 MPa19700 psiY direction; RT; ASTM D638
Tensile Modulus 7.777 GPa1128 ksiY direction; RT; ASTM D638
Flexural Strength 186 MPa27000 psiIPC-TM-650, 2.4.4
Peel Strength 0.877 kN/m5.00 pliCopper; 1 oz. EDC post Solder Float; IPC-TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+16 ohm-cm1.00e+16 ohm-cmCondition A; IPC 2.5.17.1
Surface Resistance 1.00e+15 ohm1.00e+15 ohmCondition A; IPC 2.5.17.1
Dielectric Constant  3.43 - 3.53
@Frequency 1e+10 Hz
3.43 - 3.53
@Frequency 1e+10 Hz
Clamped stripline, Z-direction; IPC-TM-650 2.5.5.5
 <= 3.66
@Frequency 8.00e+9 - 4.00e+10 Hz
<= 3.66
@Frequency 8.00e+9 - 4.00e+10 Hz
Differential Phase Length Method, Z-Direction
Dielectric Strength 29.7 kV/mm755 kV/inZ Direction; IPC-TM-650 2.5.6.2
Dissipation Factor 0.0037
@Frequency 1e+10 Hz
0.0037
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
 
Thermal PropertiesMetricEnglishComments
CTE, linear  9.00 µm/m-°C
@Temperature -55.0 - 288 °C
5.00 µin/in-°F
@Temperature -67.0 - 550 °F
Y-Direction; ASTM D3386-94
 11.0 µm/m-°C
@Temperature -55.0 - 288 °C
6.11 µin/in-°F
@Temperature -67.0 - 550 °F
X-Direction; ASTM D3386-94
 26.0 µm/m-°C
@Temperature -55.0 - 288 °C
14.4 µin/in-°F
@Temperature -67.0 - 550 °F
Z-Direction; ASTM D3386-94
Thermal Conductivity 0.560 W/m-K
@Temperature 80.0 °C
3.89 BTU-in/hr-ft²-°F
@Temperature 176 °F
ASTM C518
Glass Transition Temp, Tg >= 280 °C>= 536 °FTGA, Condition A; IPC-TM-650 2.4.24
Decomposition Temperature 390 °C734 °FTGA; ASTM D3850
Flammability, UL94 V-0V-0
 
Descriptive Properties
Dimensional Stability< 0.5 mm/mX, Y directions; after etch; +E2/150°C; IPC-TM-650, 2.4.39A
Thermal Coefficient of Dielectric Constant50 ppm/°CIPC-TM-650 2.5.5.5; -100°C to 250°C; Z-Direction

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Chemically Resistant adhesives

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