MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Master Bond adhesives

(Viewing data as-entered. Click here to return)
Hexcel® HexPly® F655 Bismaleimide Resin, Carbon Tape Form
Categories: Polymer; Thermoset; Bismaleimide (BMI)

Material Notes: Fiber: T300-12K, IM7-12K

Information provided by HexCel

Key Words: BMI
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.53 - 1.56 g/ccLaminate
Filler Content 55.0 - 59.0 %Laminate Fiber Volume
Volatiles <= 2.0 %Prepreg
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength, Yield 16.0 MPa
@Temperature 177 °C
IM7 (12K); [90°]16; Wet Condition
 42.0 MPa
@Temperature 232 °C
IM7 (12K); [90°]16
 66.0 MPa
@Temperature 23.0 °C
 148 MPa
@Temperature 177 °C
T300 (6K); [+/- 45°]2s; Wet Condition
 202 MPa
@Temperature 177 °C
T300 (6K); [+/- 45°]2s
 216 MPa
@Temperature 23.0 °C
 1517 MPa
@Temperature 23.0 °C
 2013 MPa
@Temperature 232 °C
IM7 (12K); [0°]8
 2068 MPa
@Temperature 177 °C
IM7 (12K); [0°]8; Wet Condition
 2730 MPa
@Temperature 23.0 °C
Elongation at Yield 0.2875 %
@Temperature 177 °C
IM7 (12K); [90°]16; Wet Condition
 0.6215 %
@Temperature 232 °C
IM7 (12K); [90°]16
 0.7668 %
@Temperature 23.0 °C
 1.04 %
@Temperature 23.0 °C
 1.61 %
@Temperature 23.0 °C
Tensile Modulus 6.00 GPa
@Temperature 177 °C
IM7 (12K); [90°]16; Wet Condition
 6.50 GPa
@Temperature 177 °C
T300 (6K); [+/- 45°]2s; Wet Condition
 7.90 GPa
@Temperature 232 °C
IM7 (12K); [90°]16
 9.20 GPa
@Temperature 23.0 °C
 15.7 GPa
@Temperature 177 °C
T300 (6K); [+/- 45°]2s
 16.5 GPa
@Temperature 23.0 °C
 142.7 GPa
@Temperature 23.0 °C
 160.6 GPa
@Temperature 23.0 °C
 163.4 GPa
@Temperature 232 °C
IM7 (12K); [0°]8
 164.8 GPa
@Temperature 177 °C
IM7 (12K); [0°]8; Wet Condition
Flexural Yield Strength 48.0 MPa
@Temperature 177 °C
T300 (6K); [90°]16; Wet Condition
 80.0 MPa
@Temperature 232 °C
T300 (6K); [90°]16
 107 MPa
@Temperature 177 °C
T300 (6K); [90°]16
 138 MPa
@Temperature 23.0 °C
 1110 MPa
@Temperature 177 °C
T300 (6K); [0°]16; Wet Condition
 1351 MPa
@Temperature 232 °C
T300 (6K); [0°]16
 1655 MPa
@Temperature 177 °C
T300 (6K); [0°]16
 2127 MPa
@Temperature 23.0 °C
Flexural Modulus 5.30 GPa
@Temperature 177 °C
T300 (6K); [90°]16; Wet Condition
 7.70 GPa
@Temperature 232 °C
T300 (6K); [90°]16
 9.00 GPa
@Temperature 177 °C
T300 (6K); [90°]16
 9.90 GPa
@Temperature 23.0 °C
 127.6 GPa
@Temperature 177 °C
T300 (6K); [0°]16; Wet Condition
 137.9 GPa
@Temperature 23.0 °C
 138.6 GPa
@Temperature 177 °C
T300 (6K); [0°]16
 142.7 GPa
@Temperature 232 °C
T300 (6K); [0°]16
Compressive Yield Strength 113.3 MPa
@Temperature 177 °C
T300 (6K); [0°]8; Wet Condition
 164 MPa
@Temperature 23.0 °C
 212 MPa
@Temperature 23.0 °C
 218 MPa
@Temperature 23.0 °C
 243 MPa
@Temperature 23.0 °C
 243 MPa
@Temperature 177 °C
IM7 (12K); Open Hole Compression; [45°, 0°, -45°, 90°]4s; Wet Condition
 285 MPa
@Temperature 232 °C
IM7 (12K); Open Hole Compression; [45°, 0°, -45°, 90°]4s
 336 MPa
@Temperature 23.0 °C
 968 MPa
@Temperature 177 °C
IM7 (12K); [0°]8; Wet Condition
 1181 MPa
@Temperature 232 °C
IM7 (12K); [0°]8
 1575 MPa
@Temperature 177 °C
T300 (6K); [0°]8
 1671 MPa
@Temperature 23.0 °C
 2167 MPa
@Temperature 23.0 °C
Compressive Modulus 38.9 GPa
@Temperature 23.0 °C
 42.6 GPa
@Temperature 23.0 °C
 51.7 GPa
@Temperature 23.0 °C
 51.7 GPa
@Temperature 23.0 °C
Shear Modulus 2.80 GPa
@Temperature 177 °C
IM7 (12K); [+/- 45°]2s; Wet Condition
 3.90 GPa
@Temperature 232 °C
IM7 (12K); [+/- 45°]2s
 4.30 GPa
@Temperature 177 °C
T300 (6K); [+/- 45°]2s
 4.90 GPa
@Temperature 23.0 °C
 5.20 GPa
@Temperature 23.0 °C
Shear Strength 52.0 MPaT300 (6K); Short Beam; [0°]16; Wet Condition
 52.0 MPaT300 (6K); Short Beam; [0°]16
 55.0 MPaT300 (6K); Short Beam; [0°]16; Wet Condition
 67.0 MPaT300 (6K); Short Beam; [0°]16
 88.0 MPaT300 (6K); Short Beam; [0°]16
 72.0 MPa
@Temperature 177 °C
T300 (6K); [+/- 45°]2s; Wet Condition
 74.0 MPa
@Temperature 177 °C
IM7 (12K); [+/- 45°]2s; Wet Condition
 79.0 MPa
@Temperature 232 °C
IM7 (12K); [+/- 45°]2s
 101 MPa
@Temperature 177 °C
T300 (6K); [+/- 45°]2s
 108 MPa
@Temperature 23.0 °C
 125 MPa
@Temperature 23.0 °C
 130 MPa
@Temperature 23.0 °C
 142 MPa
@Temperature 23.0 °C
 
Descriptive Properties
Cured Thickness per Ply (cm)0.013-0.015Laminate
Dry Resin Content (%)33-37Prepreg

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
Hexcel® HexPly® F655 Bismaleimide Resin
Vyncolit Neopreg Kinel® SK4503 S5 Aramid Reinforced Molding Compound
Evonik Compimide® TM124-ether 2,2'-Bis(4-allyloxyphenyl)propane
Evonik Compimide® TM124 2,2'-Bis(3-allyl-4-hydroxyphenyl)propane
Evonik Compimide® TM123 4,4'-Bis(o-propenylphenoxy)benzophenone

PHEXC012 / 98482

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.