Lord Adhesives Thermoset™ ME-531 Underfill Encapsulant

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

Lord Adhesives Thermoset™ ME-531 Underfill Encapsulant
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	LORD Thermoset™ ME-531 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and with the necessary structural strength to handle over-molding processes. Thermoset ME-531 encapsulant is engineered to withstand 260°C peak reflow temperatures of lead-free solders. All information provided by Lord.
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Metric	English	Comments

Specific Gravity	1.71 g/cc	1.71 g/cc
Water Absorption	<= 0.50 %	<= 0.50 %
Brookfield Viscosity	4000 cP @Temperature 25.0 °C	4000 cP @Temperature 77.0 °F	Spindle CP40 @ 5rpm

Mechanical Properties	Metric	English	Comments
Modulus of Elasticity	6.00 GPa	870 ksi	Storage
Shear Strength	62.0 MPa	8990 psi	Die

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+15 ohm-cm @Temperature 25.0 °C	1.00e+15 ohm-cm @Temperature 77.0 °F

Thermal Properties	Metric	English	Comments
CTE, linear	21.0 µm/m-°C	11.7 µin/in-°F	Alpha 1
	85.0 µm/m-°C	47.2 µin/in-°F	Alpha 2
Glass Transition Temp, Tg	140 °C	284 °F	TMA

Processing Properties	Metric	English	Comments
Cure Time	15.0 min @Temperature 165 °C	0.250 hour @Temperature 329 °F
	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F
Pot Life	960 min @Temperature 25.0 °C	960 min @Temperature 77.0 °F
Gel Time	6.00 min @Temperature 150 °C	6.00 min @Temperature 302 °F
Shelf Life	6.00 Month @Temperature -40.0 °C	6.00 Month @Temperature -40.0 °F

Component Elements Properties	Metric	English	Comments
Potassium, K	<= 0.00010 %	<= 0.00010 %
Sodium, Na	<= 0.00050 %	<= 0.00050 %

Descriptive Properties
Appearance	Black
Chloride (%)	< 0.001
Consistency	Low-Viscosity Liquid

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Lord Adhesives Thermoset™ MT-125 Thermally Conductive Adhesive
Lord Adhesives Thermoset™ TC-228 Thermally Conductive Grease
Lord Adhesives 8651 Polymer Resistor Composition

PLORD098 / 86106

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message