LORD Thermoset™ ME-531 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and with the necessary structural strength to handle over-molding processes. Thermoset ME-531 encapsulant is engineered to withstand 260°C peak reflow temperatures of lead-free solders. All information provided by Lord. |