| Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. Low viscosity version of EPO-TEK® H31. Advantages & Application Notes: - Exhibits a smooth, flowing consistency that is adaptable to conventional processing methods such as dispensing and screen printing. See Technical Paper #43 from our website link for hints and best practices for high speed auger screw dispensing
- Performs exceptionally well as a die attach for small chips such as GaAs, LEDs and diodes.
- Capable of resisting 260°C green reflow process, low outgassing in hermetic lid-seal processes near 300°C, and organic burn-in up to 150°C/1000 hours storage.
- Certified to MIL-STD 883/Test Method 5011 –yields low levels of water extractable monovalent ions such as Chlorides.
- Passes NASA low outgassing standard ASTM E595 with proper cure
- Capable of JEDEC Level II die-attach packaging on die-paddles and lead-frames.
- Widely used epoxy; popular choice for silver-filled epoxies; opto-packaging, hybrids, and many types of substrates including kovar, ceramic and BT.
- Available in many different viscosity ranges
Information Provided by Epoxy Technology |
