HexFlow® RTM651 is a one-component modified bismaleimide for resin transfer molding (RTM). Upon heating to 212-248°F, the resin will become a low viscosity homogeneous liquid that has a long pot-life and processes easily. Postcure can be carried out free standing. HexFlow® RTM651 is a premixed bismaleimide system for service temperature to 450°F.Features: Monocomponent system; High glass transition temperature (545°F); Excellent elevated temperature properties; Easy to process; Free standing postcure; Short, simple cure cycles. |