Hexcel® HexFlow® RTM651 One-part Modified BMI Resin

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Hexcel® HexFlow® RTM651 One-part Modified BMI Resin
Categories:	Polymer; Thermoset; Epoxy; Epoxy Cure Resin
Material Notes:	HexFlow® RTM651 is a one-component modified bismaleimide for resin transfer molding (RTM). Upon heating to 212-248°F, the resin will become a low viscosity homogeneous liquid that has a long pot-life and processes easily. Postcure can be carried out free standing. HexFlow® RTM651 is a premixed bismaleimide system for service temperature to 450°F. Features: Monocomponent system; High glass transition temperature (545°F); Excellent elevated temperature properties; Easy to process; Free standing postcure; Short, simple cure cycles.
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Physical Properties	Original Value	Comments

Specific Gravity	1.25 g/cc
Viscosity	>= 15 cP @Temperature 156 °C
	50 cP @Temperature 120 °C	0 Hour
	67 cP @Temperature 120 °C	1 Hour
	80 cP @Temperature 110 °C	0 Hour
	120 cP @Temperature 110 °C	1 Hour

Mechanical Properties	Original Value	Comments
Tensile Strength, Yield	10.5 ksi	Resin property; RT; Dry
	41.5 ksi @Temperature 175 °C	Laminate property; Open Hole Tension; Conditioning: 158°F 85% RH sat
	41.8 ksi @Temperature 190 °C	Laminate property; Open Hole Tension; Conditioning: 158°F 85% RH sat
	42.2 ksi @Temperature 175 °C	Laminate property; Open Hole Tension; Conditioning: 14 days Water 158°F
	43.2 ksi @Temperature 190 °C	Laminate property; Open Hole Tension; Conditioning: 14 days Water 158°F
	114.5 ksi @Temperature 22.8 °C	Laminate property; Dry
Elongation at Break	2.19 %	Resin property; RT; Dry
Tensile Modulus	591 ksi	Resin property; RT; Dry
	9000 ksi @Temperature 73.0 °C	Laminate property; Dry
Flexural Yield Strength	20.4 ksi	Resin property; RT; Dry
	15.8 ksi @Temperature 177 °C	Resin property; Dry
Flexural Modulus	612 ksi	Resin property; RT; Dry
	455 ksi @Temperature 177 °C	Resin property; Dry
Fracture Toughness	1.05 MPa-m½
Shear Modulus	430 ksi @Temperature 175 °C	Laminate property; In Plane Shear; Conditioning: 14 days Water 158°F
	470 ksi @Temperature 175 °C	Laminate property; In Plane Shear; Conditioning: 158°F 85% RH sat
	700 ksi @Temperature 22.8 °C	Laminate property; In Plane Shear; Conditioning: Dry
Shear Strength	4.80 ksi @Temperature 175 °C	Laminate property; In Line Shear; Conditioning: 14 days Water 158°F
	5.40 ksi @Temperature 175 °C	Laminate property; In Line Shear; Conditioning: 158°F 85% RH sat
	6.90 ksi @Temperature 22.8 °C	Laminate property; In Plane Shear; Conditioning: Dry
	8.40 ksi @Temperature 22.8 °C	Laminate property; In Line Shear; Conditioning: Dry
	9.40 ksi @Temperature 175 °C	Laminate property; In Plane Shear; Conditioning: 14 days Water 158°F
	9.40 ksi @Temperature 175 °C	Laminate property; In Plane Shear; Conditioning: 158°F 85% RH sat

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	450 °F
Glass Transition Temp, Tg	426 °F	Wet, (DMA, E" Peak)
	545 °F	Dry, (DMA, E" Peak)

Processing Properties	Original Value	Comments
Gel Time	5.00 min @Temperature 200 °C
	23.0 min @Temperature 177 °C
	62.0 min @Temperature 160 °C
	98.0 min @Temperature 150 °C
Shelf Life	12.0 Month @Temperature -17.8 °C

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PHEXC483 / 99302

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