MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 165,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
Chemically Resistant adhesives
Aptek 3101 B/C/B Thermally conductive urethane film adhesive
Categories: Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive

Material Notes: Thermally conductive, electrically insulating hybrid urethane film adhesive
APTEK 1301 B/C/B is a low modulus, flexible, void free, electrically insulating hybrid urethane film adhesive designed to bond dissimilar components and substrates. This B/C/B system is designed to manage stresses developed from mismatches of thermal expansion coefficients during temperature cycling as well as to dissipate heat generated from components and circuitry. APTEK 1301 B/C/B technology incorporates a partially-cured (B-staged) adhesive on both faces of a fully-cured (C-staged) ultra low modulus film. APTEK 1301 B/C/B film is a 100% solids, thermoset polymer, which will not outgas, while in place and is suitable for high vacuum environments. The film exhibits outstanding reversion resistance and physical stability under long-term aging of high humidity and heat.

Low modulus/high elongation for minimum stress to sensitive components and ceramic substrates; Low Tg-remains flexible to -75ÂșC; Exceeds NASA outgassing requirements for high vacuum environments; Typical film thickness, .006" to .012"; Available in sheet or die-cut forms; Low tack adhesive layer allows for easy placement and, if needed, repositioning on assemblies

Information provided by Aptek Laboratories, Inc.

Available Properties
  • Density, ASTM D1475
  • Moisture Absorption at Equilibrium, Cured property; ASTM D570
  • Outgassing - Total Mass Loss, Cured property; at 10E-6 torr; ASTM E595
  • Collected Volatile Condensable Material, Cured property; at 10E-6 torr; ASTM E595
  • Tensile Strength, Ultimate, ASTM D638, Cured
  • Elongation at Break, ASTM D638, Cured
  • Tensile Modulus, ASTM D638, Cured
  • Volume Resistivity, Cured property; ASTM D257
  • Dielectric Constant, ASTM D150, Cured property
  • Dielectric Strength, ASTM D149, Cured
  • Dissipation Factor, ASTM D150, Cured property
  • CTE, linear, Cured property; alpha 1
  • CTE, linear, Cured property; alpha 2
  • Thermal Conductivity
  • Glass Transition Temp, Tg, Cured property; ASTM E831-86
  • Processing Temperature, Cure 4 hrs
  • Processing Temperature, Cure 2 hrs
  • Processing Temperature, Cure 1 hrs
Property Data

This page displays only the text
of a material data sheet.

To see MatWeb's complete data
sheet for this material (including
material property data, metal
compositions, material suppliers,
), please click the button below.

Manufacturer Notes:

Category Notes

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.


Chemically Resistant adhesives
Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2023 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.