Thermally conductive, electrically insulating hybrid urethane film adhesive
APTEK 1301 B/C/B is a low modulus, flexible, void free, electrically insulating hybrid urethane film adhesive designed to bond dissimilar components and substrates. This B/C/B system is designed to manage stresses developed from mismatches of thermal expansion coefficients during temperature cycling as well as to dissipate heat generated from components and circuitry. APTEK 1301 B/C/B technology incorporates a partially-cured (B-staged) adhesive on both faces of a fully-cured (C-staged) ultra low modulus film. APTEK 1301 B/C/B film is a 100% solids, thermoset polymer, which will not outgas, while in place and is suitable for high vacuum environments. The film exhibits outstanding reversion resistance and physical stability under long-term aging of high humidity and heat.Low modulus/high elongation for minimum stress to sensitive components and ceramic substrates; Low Tg-remains flexible to -75ºC; Exceeds NASA outgassing requirements for high vacuum environments; Typical film thickness, .006" to .012"; Available in sheet or die-cut forms; Low tack adhesive layer allows for easy placement and, if needed, repositioning on assemblies Information provided by Aptek Laboratories, Inc. |
