Cookson Group Plaskon® 3400FP Epoxy Molding Compound

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Cookson Group Plaskon® 3400FP Epoxy Molding Compound (discontinued **)
Categories:	Polymer; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	Test specimens were transfer molded and post cured 4 hours at 175°C. A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs and medium lead count QFPs. Fast cycle times; Excellent moldability (ease of filling, good release, minimal flash and bleed and good hot hardness); Superior cosmetics; Improved markability; Minimal mold cleaning frequency
Vendors:

Available Properties
Density Viscosity, Automatic orifice Viscosity Spiral Flow, 177°C/1000 psi Hardness, Shore D Flexural Strength Flexural Modulus Dielectric Constant Dielectric Strength Dissipation Factor Arc Resistance CTE, linear CTE, linear, Transverse to Flow Thermal Conductivity Glass Transition Temp, Tg Flammability, UL94 Flammability, UL94 Processing Temperature, Molding temperature

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

**
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