Cookson Group Plaskon® 3400FP Epoxy Molding Compound

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Cookson Group Plaskon® 3400FP Epoxy Molding Compound (discontinued **)
Categories:	Polymer; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	Test specimens were transfer molded and post cured 4 hours at 175°C. A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs and medium lead count QFPs. Fast cycle times; Excellent moldability (ease of filling, good release, minimal flash and bleed and good hot hardness); Superior cosmetics; Improved markability; Minimal mold cleaning frequency
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Physical Properties	Original Value	Comments

Density	1.80 g/cc
Viscosity	14000 cP @Temperature 175 °C	Automatic orifice Viscosity
Spiral Flow	59.0 - 83.0 cm	177°C/1000 psi

Mechanical Properties	Original Value	Comments
Hardness, Shore D	70
Flexural Strength	124 MPa
Flexural Modulus	15.0 GPa

Electrical Properties	Original Value	Comments
Dielectric Constant	3.6 @Frequency 1000 Hz
Dielectric Strength	16.0 kV/mm
Dissipation Factor	0.0030 @Frequency 1000 Hz
Arc Resistance	180 sec

Thermal Properties	Original Value	Comments
CTE, linear	22.0 µm/m-°C @Temperature 20.0 °C
CTE, linear, Transverse to Flow	60.0 µm/m-°C @Temperature 20.0 °C
Thermal Conductivity	0.700 W/m-K
Glass Transition Temp, Tg	150 °C
Flammability, UL94	V-0 @Thickness 3.20 mm
	V-0 @Thickness 3.20 mm

Processing Properties	Original Value	Comments
Processing Temperature	170 - 185 °C	Molding temperature

**
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