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Master Bond adhesives
Hexcel® HexPly® F652 Bismaleimide Resin
Categories: Polymer; Thermoset; Bismaleimide (BMI)

Material Notes: HexPly® F652 is a bismaleimide resin that cures via an addition reaction with no condensation by-products. HexPly® F652 is a controlled flow polyimide resin system designed for alternative processing capabilities such as co-curing over honeycomb core, compression molding, as well as standard autoclave processing.

Information provided by HexCel

Key Words: BMI
Vendors:
Available Properties
  • Specific Gravity
  • Moisture Absorption at Equilibrium
  • Fracture Toughness
  • Dielectric Constant, ASTM D2520, +/- 2%
  • Dielectric Constant, ASTM D2520, +/- 2%
  • Dielectric Constant, ASTM D2520, +/- 2%
  • Dielectric Constant, ASTM D2520, +/- 2%
  • Dielectric Constant, ASTM D2520, +/- 2%
  • Dielectric Constant, ASTM D2520, +/- 2%
  • Dielectric Constant, ASTM D2520, +/- 2%
  • Dielectric Constant, ASTM D2520, +/- 2%
  • Dielectric Constant, ASTM D2520, +/- 2%
  • Dielectric Loss Index, ASTM D2520, F652 Resin Casting; +/- 0.5
  • Dielectric Loss Index, ASTM D2520, F652 Resin Casting; +/- 0.5
  • Dielectric Loss Index, ASTM D2520, F652 Resin Casting; +/- 0.5
  • Dielectric Loss Index, ASTM D2520, F652 Resin Casting; +/- 0.5
  • Dielectric Loss Index, ASTM D2520, F652 Resin Casting; +/- 0.5
  • Dielectric Loss Index, ASTM D2520, F652 Resin Casting; +/- 0.5
  • Dielectric Loss Index, ASTM D2520, F652 Resin Casting; +/- 0.5
  • Dielectric Loss Index, ASTM D2520, F652 Resin Casting; +/- 0.5
  • Dielectric Loss Index, ASTM D2520, F652 Resin Casting; +/- 0.5
  • CTE, linear
  • Glass Transition Temp, Tg, Wet
  • Glass Transition Temp, Tg, Dry
  
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Manufacturer Notes:
none

Category Notes
Plastic

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