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Master Bond adhesives
Lord Adhesives Thermoset™ 311 Epoxy Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes: LORD Thermoset 311 epoxy encapsulant is a two-component, filled epoxy system designed for electrical and electronic applications requiring high operating temperatures. Thermoset 311 encapsulant provides a semi-rigid epoxy system for use in applications where high thermal shock is expected. With preheating, encapsulant can be used for vacuum impregnation applications.

Features: exhibits excellent electrical properties at operating temperatures from -55°C to 155°C. provides excellent resistance to thermal shock; provides protection of electrical devices exposed to harsh environmental conditions. exhibits very low weight loss over extended periods at elevated temperatures.

All information provided by Lord.
Vendors:
Available Properties
  • Specific Gravity, 311 Hardener
  • Specific Gravity, Mixed
  • Specific Gravity, 311 Resin
  • Water Absorption, ASTM D 570, cured
  • Viscosity, 311 Hardener
  • Viscosity, mixed
  • Viscosity, 311 Resin
  • Hardness, Shore D, ASTM D 2240
  • Tensile Strength, ASTM D 638, cured
  • Elongation at Break, ASTM D 638
  • Volume Resistivity, ASTM D 257, cured
  • Dielectric Constant, ASTM D 150, cured
  • Dielectric Strength, ASTM D 149
  • Dissipation Factor, ASTM D 150, cured
  • CTE, linear
  • Working Life, Mixed
  • Gel Time, mixed
  • Shelf Life, each component from date of manufacture
  
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Manufacturer Notes:
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Category Notes
Plastic

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