LORD Thermoset 311 epoxy encapsulant is a two-component, filled epoxy system designed for electrical and electronic applications requiring high operating temperatures. Thermoset 311 encapsulant provides a semi-rigid epoxy system for use in applications where high thermal shock is expected. With preheating, encapsulant can be used for vacuum impregnation applications. Features: exhibits excellent electrical properties at operating temperatures from -55°C to 155°C. provides excellent resistance to thermal shock; provides protection of electrical devices exposed to harsh environmental conditions. exhibits very low weight loss over extended periods at elevated temperatures. All information provided by Lord. |