| Description: Master Bond Polymer System SURPEME 11AO is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a convenient one-to-one (1:1) mix ratio by weight or volume. Its most outstanding features include high thermal conductivity, excellent electrical insulation properties, temperature resistance up to 250°F as well as superior bond strength. SURPEME 11AO is a paste that can be applied without sagging or dripping even on vertical surfaces. As a toughened system, it is well suited to applications involving thermal cycling. Its chemical resistance profile includes water, oils and most organic solvents. It has excellent adhesion to most metals, ceramics, glass and vulcanized rubbers as well as many plastics. SURPEME 11AO is also unique in that the bond strength is high in both shear and peel modes. Both part A and B are colored off-white. Master Bond SURPEME 11AO is widely used in the electronic,. electrical, computer, metalworking, appliance, automotive and chemical industries where high bond strength and superior heat transfer properties are required. Product Advantages: - Easy application; adhesive spreads evenly and smoothly.
- Versatile cure schedules; ambient temperature cures or faster elevated temperature cures as required.
- High bond strength to a wide variety of substrates; excellent adhesive properties.
- High thermal conductivity with exceptional electrical insulation properties.
- Toughened system; well suited for bonding dissimilar substrates.
- Good physical strength characteristics; especially high shear & peel strengths.
- Thick paste; non-drip type system.
- Outstanding resistance to a wide range of chemicals.
- Thermally stable up to 250°F with good thermal cycling properties.
Information provided by MasterBond® |
