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Chemically Resistant adhesives
Tra-Con Tra-Duct 2960 Snap Cure Electrically Conductive Silver-Filled Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive; Filled/Reinforced Thermoset

Material Notes: TRA-DUCT 2960 is a one or two-part, specially refined and processed silver filled adhesive for high speed manufacturing. Recommended for the microelectronic, automotive computer and telecommunications assembly and packaging industries. TRA-DUCT 2960 provides high electrical and thermal conductivity , along with excellent adhesion to numerous substrate materials. Ideal for chip/die bonding or heat sink attach, TRA-DUCT 2960 snap cures in 2 minutes at 150°C and can withstand operating temperatures up to 175°C. TRA-DUCT 2960 was designed for high speed component attachment of electronic modules, printed circuit board assembly and high frequency shielding, when screen printing or automatic dispensing is desired.

Information provided by Tra-Con Inc.

Available Properties
  • Specific Gravity, Mixed
  • Volatile Organic Compounds (VOC) Content
  • Water Absorption, After 24 hours
  • Viscosity, Mixed (sp #7, 10 rpm)
  • Hardness, Shore D
  • Adhesive Bond Strength, Lap shear, alum to alum, 15 min @ 100°C
  • Adhesive Bond Strength, Lap shear, alum to alum, 2 min @ 150°C
  • Adhesive Bond Strength, Lap shear, alum to alum, 5 min @ 125°C
  • Volume Resistivity, cured 2 min @ 150°C
  • Volume Resistivity, cured 5 min @ 125°C
  • Volume Resistivity, cured 15 min @ 100°C
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Glass Transition Temp, Tg, Ultimate Tg
  • Cure Time
  • Cure Time
  • Cure Time
  • Pot Life, 25 grams
Property Data

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Manufacturer Notes:
Tra-Con, Inc.

Category Notes

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Chemically Resistant adhesives
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