TRA-DUCT 2960 is a one or two-part, specially refined and processed silver filled adhesive for high speed manufacturing. Recommended for the microelectronic, automotive computer and telecommunications assembly and packaging industries. TRA-DUCT 2960 provides high electrical and thermal conductivity , along with excellent adhesion to numerous substrate materials. Ideal for chip/die bonding or heat sink attach, TRA-DUCT 2960 snap cures in 2 minutes at 150°C and can withstand operating temperatures up to 175°C. TRA-DUCT 2960 was designed for high speed component attachment of electronic modules, printed circuit board assembly and high frequency shielding, when screen printing or automatic dispensing is desired. Information provided by Tra-Con Inc. |