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Amatrium Materials AI
Reltek BONDiT™ B-482 Adhesive, Sealant & Coating System
Categories: Polymer; Adhesive; Thermoset

Material Notes: Key Properties:
  • Excellent balance of chemical, electrical, and mechanical properties.
  • Ruggedized, semi-flexible system.
  • Very clean system.
  • Ease of use.

Applications: Encapsule sensitive instrumentation for chemical isolation, outstanding moisture resistance, ruggedness and flexibility. Suitable for clean room use and direct contact with semiconductors. Very easy to use and clean two-part system. Superior for coating in marine applications and other harsh environments. Tough, chemically-resistant, non-blush clear coating with medium gloss finish. Bonds to most substrates. Ambient 24 hour or accelerated thermal cure.

Key Words: Epoxy Adhesive, Sealant
Vendors:
Available Properties
  • Water Absorption, 24hrs boiling DI water
  • Viscosity
  • Tensile Strength at Break, 2hrs @200°F+45days @ ambient; 2:1 Volume mix
  • Tensile Strength, Ultimate, Peak; 2hrs @200°F+45days @ ambient; 2:1 Volume mix
  • Tensile Strength, Yield, 2hrs @200°F+45days @ ambient; 2:1 Volume mix
  • Elongation at Break, 2hrs @200°F+45days @ ambient; 2:1 Volume mix
  • Elongation at Yield, 2hrs @200°F+45days @ ambient; 2:1 Volume mix
  • Tangent Modulus, 2hrs @200°F+45days @ ambient; 2:1 Volume mix
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time, Ambient Set
  • Cure Time, Ambient, 95% cure
  • Cure Time, 98% cure
  • Tack-Free Time, Ambient
  • Pot Life, Ambient
  
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Manufacturer Notes:
Reltek LLC

Category Notes
Plastic

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