Reltek BONDiT™ B-482 Adhesive, Sealant & Coating System

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Reltek BONDiT™ B-482 Adhesive, Sealant & Coating System
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	Key Properties: Excellent balance of chemical, electrical, and mechanical properties. Ruggedized, semi-flexible system. Very clean system. Ease of use. Applications: Encapsule sensitive instrumentation for chemical isolation, outstanding moisture resistance, ruggedness and flexibility. Suitable for clean room use and direct contact with semiconductors. Very easy to use and clean two-part system. Superior for coating in marine applications and other harsh environments. Tough, chemically-resistant, non-blush clear coating with medium gloss finish. Bonds to most substrates. Ambient 24 hour or accelerated thermal cure.
Key Words:	Epoxy Adhesive, Sealant
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Physical Properties	Original Value	Comments

Water Absorption	<= 1.0 %	24hrs boiling DI water
Viscosity	2500 cP

Mechanical Properties	Original Value	Comments
Tensile Strength at Break	2602 psi	2hrs @200°F+45days @ ambient; 2:1 Volume mix
Tensile Strength, Ultimate	2716 psi	Peak; 2hrs @200°F+45days @ ambient; 2:1 Volume mix
Tensile Strength, Yield	2717 psi	2hrs @200°F+45days @ ambient; 2:1 Volume mix
Elongation at Break	23.9 %	2hrs @200°F+45days @ ambient; 2:1 Volume mix
Elongation at Yield	11.3 %	2hrs @200°F+45days @ ambient; 2:1 Volume mix
Tangent Modulus	53535 psi	2hrs @200°F+45days @ ambient; 2:1 Volume mix

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	350 °F
Minimum Service Temperature, Air	-50.0 °F

Processing Properties	Original Value	Comments
Cure Time	360 min	Ambient Set
	1440 min	Ambient, 95% cure
	240 min @Temperature 65.6 °C	98% cure
Tack-Free Time	720 min	Ambient
Pot Life	40 min	Ambient

Descriptive Properties
Chemical & Moisture Resistance	2.5	0=Lowest, 4=Highest
Color	Clear with slight amber
Flexibility Ranking	3	0=Rigid, 5=Highly Flexible

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