| Description: HexBond™ 679 is a modified epoxy film adhesive, designed for low temperature cure in out-of-autoclave applications. It contains a 30 g/m2 non-woven polyester/glass support for easy handling and bond-line thickness control. The product offers higher tack and lower cure viscosity to aid with substrate wetting. It is available with a resin areal weight of 150, 250 and 400 g/m2. Features: - Fully compatible with HexPly® M79 o Cure cycle as low as 70°C for 8 hours (typically 4 hours @ 80°C)
- Well adapted to a wide range of processing pressures (0.3 – 5 bar)
- Diuron-free chemistry
- Less than 1% volatile content
- Suitable for bonding a wide range of substrates (-55°C to 80°C)
- Good lap shear and peel performance
- Outstanding properties in sandwich structures (honeycomb & foam cores)
- Excellent tack life to assist in adhesive joint assembly
- Superior shelf-life (6 weeks @ +23°C)
- Translucent resin after cure for easy quality inspection
Applications: - Aluminum to aluminum bonding
- Steel to steel bonding
- CFRP/GFRP to CFRP/GFRP bonding
- CFRP and GFRP to aluminum bonding
- CFRP and GFRP to steel bonding
- Sandwich bonding with a variety of skins and cores (e.g. PVC, VE, glass, polyester, aluminum, steel)
Information provided by Hexcel Corporation. |
