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Polymer Distribution
Hexcel® Redux® 312 Modified epoxy film adhesive (0.015 psf)
Categories: Polymer; Adhesive; Film; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Redux® 312 is a high-strength 250°F curing film adhesive, suitable for metal to metal bonding and sandwich constructions, where operating temperatures of up to 210°F may be experienced. A supported version, Redux® 312/5, is available with a woven nylon carrier for bond line thickness control.

Features: Short cure cycle - cures in 30 minutes at 250°F; Good mechanical performance up to 210°F; Suitable for composite to composite bonding; Low volatile content (solventless process).
Applications: Metal to metal bonding; Sandwich constructions; Composite to composite bonding.

Vendors:
Available Properties
  • Shear Strength, Lap Shear
  • Shear Strength, Lap Shear
  • Shear Strength, Lap Shear
  • Shelf Life
  
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Category Notes
Plastic

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