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Specialty Compounds RTP Company
Parker Chomerics CHO-BOND® 584-29 SYRINGE-PAK™ Silver Filled Conductive Epoxy and Hardener
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Description: Chomerics CHO-BOND 584-29 is a two-component, highly conductive adhesive system that combines the strong adhesive characteristics of epoxy with the superior conductivity of pure silver. This new syringe system simplifies the mixing of resin and hardening components, and improves dispensing accuracy and efficiency. This result is less compound waste and lower applied cost.

Features: Easy and efficient application system; Pure silver filler. Superior conductivity; 100% solids, no VOC’s and Room temperature cure in 24 hours

Information provided by Chomerics

Vendors:
Available Properties
  • Specific Gravity, ASTM D792
  • Shear Strength, ASTM D1022, Lap
  • Volume Resistivity, Chomerics 95-40-5101 and 95-40-5102
  • Cure Time
  • Shelf Life
  
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Manufacturer Notes:
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Category Notes
Plastic

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