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Ensinger PEI

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Parker Chomerics CHO-BOND® 584-29 SYRINGE-PAK™ Silver Filled Conductive Epoxy and Hardener
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Description: Chomerics CHO-BOND 584-29 is a two-component, highly conductive adhesive system that combines the strong adhesive characteristics of epoxy with the superior conductivity of pure silver. This new syringe system simplifies the mixing of resin and hardening components, and improves dispensing accuracy and efficiency. This result is less compound waste and lower applied cost.

Features: Easy and efficient application system; Pure silver filler. Superior conductivity; 100% solids, no VOC’s and Room temperature cure in 24 hours

Information provided by Chomerics

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.20 g/ccASTM D792
 
Mechanical PropertiesOriginal ValueComments
Shear Strength >= 8.27 MPaLap; ASTM D1022
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 0.0020 ohm-cmChomerics 95-40-5101 and 95-40-5102
 
Processing PropertiesOriginal ValueComments
Cure Time 0.250 hour
@Temperature 113 °C
Shelf Life 9.00 Month
@Temperature 24.0 °C
 
Descriptive Properties
FillerAg
Mix Ratio0.069
Work Life0.5 hrs

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PCHOME206 / 130916

Proto3000 – 3D Engineering Solutions

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