| UPILEX®-SGA is a polyimide film having improved adhesion properties created by a special process to both sides of the UPILEX®-S. It is suitable for sputtering or plating processes because of high surface adhesion. It offers a flexible base for high-performance electronic circuits. In addition, it can also be used as an adhesive tape base material for LOC packaging. In sputtering or plating, a flexible base for electronic circuits that does not use any adhesives can be obtained. Peel strength is high, surface smoothness is very high. Superior mechanical property, with low water absorption, excellent dimensional stability and high heat resistance comparable to UPILEX®-S.Information provided by UBE Industries, LTD |
