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Master Bond adhesives

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UBE UPILEX®-SGA 50SGA Polyimide
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: UPILEX®-SGA is a polyimide film having improved adhesion properties created by a special process to both sides of the UPILEX®-S. It is suitable for sputtering or plating processes because of high surface adhesion. It offers a flexible base for high-performance electronic circuits. In addition, it can also be used as an adhesive tape base material for LOC packaging. In sputtering or plating, a flexible base for electronic circuits that does not use any adhesives can be obtained. Peel strength is high, surface smoothness is very high. Superior mechanical property, with low water absorption, excellent dimensional stability and high heat resistance comparable to UPILEX®-S.

Information provided by UBE Industries, LTD

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Physical PropertiesOriginal ValueComments
Density 1.47 g/ccASTM D1505
Water Absorption 1.4 %ASTM D570
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 490 MPaASTM D882
Elongation at Break 45 %ASTM D882
Tensile Modulus 9.70 GPaASTM D882
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+14 ohm-cmDC 100V; ASTM D257
Surface Resistance >= 1.00e+16 ohmDC 100V; ASTM D257
Dielectric Strength 10.6 kV/mmASTM D149
 
Thermal PropertiesOriginal ValueComments
CTE, linear 14.0 µm/m-°C
@Temperature 50.0 - 200 °C
Fine linear dilatometer
Shrinkage 0.060 %
@Temperature 200 °C,
Time 7200 sec
heat; ASTM D1204

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PUBD9854 / 287317

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