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Master Bond adhesives
Lord Adhesives Thermoset™ TC-330 Thermally Conductive Silicone Grease
Categories: Fluid; Lubricant; Silicone Base; Silicone, Filled Grease

Material Notes: TC-330 is smooth, gray, microelectronics-grade, silicone-based, thermally conductive grease compound. It offers very high thermal conductivity, high temperature resistance, very low thermal resistance and easy dispensability. It is rated for use in applications where the continuous operating temperature is < 200°C and can withstand intermittent exposures up to 250-260°C. TC-330 has been designed for use in applications where device wattage’s can exceed 100 W and where the device may later need to be easily removed from the heat sink. It can be used with a variety of emerging and standard devices including microprocessors, DSPs, graphic accelerators, etc. packaged in flip-chip, PPGA, BGA, MicroBGA and other package types. TC-330 exhibits very low bleed and has been tested extensively in demanding environments. It has shown outstanding performance in reliability testing in microprocessor and other flip-chip applications. In addition, it has a significantly lower viscosity than competitive high thermal conductivity greases and can be easily dispensed even without going to special valve technology. It has been specially formulated for use in high throughput, automated dispensing equipment without the use of needle heating.

All information provided by Lord.

Available Properties
  • Specific Gravity
  • Loss On Ignition
  • Loss On Ignition
  • Viscosity, 10rpm
  • Viscosity, 1rpm
  • Dielectric Constant, ASTM D150
  • Dielectric Constant, ASTM D150
  • Dielectric Constant, ASTM D150
  • Dissipation Factor, ASTM D150
  • Dissipation Factor, ASTM D150
  • Dissipation Factor, ASTM D150
  • Maximum Service Temperature, Air
  • Shelf Life
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