| TC-330 is smooth, gray, microelectronics-grade, silicone-based, thermally conductive grease compound. It offers very high thermal conductivity, high temperature resistance, very low thermal resistance and easy dispensability. It is rated for use in applications where the continuous operating temperature is < 200°C and can withstand intermittent exposures up to 250-260°C. TC-330 has been designed for use in applications where device wattage’s can exceed 100 W and where the device may later need to be easily removed from the heat sink. It can be used with a variety of emerging and standard devices including microprocessors, DSPs, graphic accelerators, etc. packaged in flip-chip, PPGA, BGA, MicroBGA and other package types. TC-330 exhibits very low bleed and has been tested extensively in demanding environments. It has shown outstanding performance in reliability testing in microprocessor and other flip-chip applications. In addition, it has a significantly lower viscosity than competitive high thermal conductivity greases and can be easily dispensed even without going to special valve technology. It has been specially formulated for use in high throughput, automated dispensing equipment without the use of needle heating.All information provided by Lord. |
