Cookson Group Plaskon® AMC-2RC Low Stress Epoxy Molding Compound

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Cookson Group Plaskon® AMC-2RC Low Stress Epoxy Molding Compound (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound specifically formulated for encapsulation of stress sensitive electronic devices including DIPs, SOICs, SSOPs and PLCCs. It can be used in conventional or automold applications. Features: Low stress No post mold cure Fast cure rate Low viscosity Outstanding reliability Excellent shelf life Jedec Level 1 for SOICs and SSOPs High productivity Information provided by Cookson Electronics
Vendors:

Available Properties

Specific Gravity
Viscosity, Automatic orifice Viscosity
Spiral Flow, at 175°C and 1000 psi
Ash
Storage Temperature, Recommended
Hardness, Shore D, Cull hot, 90 sec @ 175°C
Flexural Strength
Flexural Modulus
Volume Resistivity
Dielectric Constant
Dielectric Strength
Dissipation Factor
CTE, linear, Alpha 1, 6 hr post cure
CTE, linear, Alpha 1, as molded
CTE, linear, Alpha 2, as molded
CTE, linear, Alpha 2, 6 hr post cure
Glass Transition Temp, Tg
Glass Transition Temp, Tg, 6 hr post cure
Flammability, UL94
Oxygen Index
Mold Temperature
Back Pressure
Cycle Time - Injection
Cure Time, Post mold
Gel Time, Ram follower, at 175°C and 1000 psi
Shelf Life, at 35°C, <40% loss of spiral flow
Shelf Life, at 21°C, <40% loss of spiral flow
Shelf Life, at 5°C, <40% loss of spiral flow

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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