Cookson Group Plaskon® AMC-2RC Low Stress Epoxy Molding Compound

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

(Viewing data as-entered. Click here to return)

Cookson Group Plaskon® AMC-2RC Low Stress Epoxy Molding Compound (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound specifically formulated for encapsulation of stress sensitive electronic devices including DIPs, SOICs, SSOPs and PLCCs. It can be used in conventional or automold applications. Features: Low stress No post mold cure Fast cure rate Low viscosity Outstanding reliability Excellent shelf life Jedec Level 1 for SOICs and SSOPs High productivity Information provided by Cookson Electronics
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Original Value	Comments

Specific Gravity	1.91 g/cc
Viscosity	7000 cP @Temperature 175 °C	Automatic orifice Viscosity
Spiral Flow	76.0 cm	at 175°C and 1000 psi
Ash	79 %
Storage Temperature	<= 5.00 °C	Recommended

Mechanical Properties	Original Value	Comments
Hardness, Shore D	72	Cull hot, 90 sec @ 175°C
Flexural Strength	19200 psi
Flexural Modulus	2.409e+6 psi

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+16 ohm-cm
Dielectric Constant	3.55 @Frequency 1000 Hz
Dielectric Strength	800 V/mil @Thickness 1.50 mm
Dissipation Factor	0.0020 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	12.0 µm/m-°C @Temperature 20.0 °C	Alpha 1, 6 hr post cure
	14.0 µm/m-°C @Temperature 20.0 °C	Alpha 1, as molded
	60.0 µm/m-°C @Temperature 20.0 °C	Alpha 2, as molded
	61.0 µm/m-°C @Temperature 20.0 °C	Alpha 2, 6 hr post cure
Glass Transition Temp, Tg	147 °C
	155 °C	6 hr post cure
Flammability, UL94	V-0 @Thickness 3.17 mm
Oxygen Index	32 %

Processing Properties	Original Value	Comments
Mold Temperature	175 °C
Back Pressure	796 - 1394 psi
Cycle Time - Injection	<= 90 sec
Cure Time	0.000 - 2.00 hour @Temperature 175 °C	Post mold
Gel Time	0.167 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.100 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Cl	<1 ppm
Preheat Temperature	85-95°C
Transfer Time	8-15 seconds

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

Users of our Advanced Search (registration required) may exclude discontinued materials from search results.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
Overview of materials for Epoxy Molding Compound
Cookson Group Plaskon® CMU-870-2C Molded Underfill Compound for Flip Chip BGAs and CSPs
Cookson Group Plaskon® CMU-870-2B Molded Underfill Compound for Flip Chip BGAs and CSPs
Cookson Group Plaskon® CMU-870-2A Molded Underfill Compound for Flip Chip BGAs and CSPs
Cookson Group Plaskon® AMC-2RA Low Stress Epoxy Molding Compound

PPLASK019 / 56309

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message