Cookson Group Plaskon® AMC-2RC Low Stress Epoxy Molding Compound

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Cookson Group Plaskon® AMC-2RC Low Stress Epoxy Molding Compound (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound specifically formulated for encapsulation of stress sensitive electronic devices including DIPs, SOICs, SSOPs and PLCCs. It can be used in conventional or automold applications. Features: Low stress No post mold cure Fast cure rate Low viscosity Outstanding reliability Excellent shelf life Jedec Level 1 for SOICs and SSOPs High productivity Information provided by Cookson Electronics
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Physical Properties	Metric	English	Comments

Specific Gravity	1.91 g/cc	1.91 g/cc
Viscosity	7000 cP @Temperature 175 °C	7000 cP @Temperature 347 °F	Automatic orifice Viscosity
Spiral Flow	76.0 cm	29.9 in	at 175°C and 1000 psi
Ash	79 %	79 %
Storage Temperature	<= 5.00 °C	<= 41.0 °F	Recommended

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	72	72	Cull hot, 90 sec @ 175°C
Flexural Strength	132.4 MPa	19200 psi
Flexural Modulus	16.61 GPa	2409 ksi

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+16 ohm-cm	1.00e+16 ohm-cm
Dielectric Constant	3.55 @Frequency 1000 Hz	3.55 @Frequency 1000 Hz
Dielectric Strength	31.5 kV/mm @Thickness 1.50 mm	800 kV/in @Thickness 0.0591 in
Dissipation Factor	0.0020 @Frequency 1000 Hz	0.0020 @Frequency 1000 Hz

Thermal Properties	Metric	English	Comments
CTE, linear	12.0 µm/m-°C @Temperature 20.0 °C	6.67 µin/in-°F @Temperature 68.0 °F	Alpha 1, 6 hr post cure
	14.0 µm/m-°C @Temperature 20.0 °C	7.78 µin/in-°F @Temperature 68.0 °F	Alpha 1, as molded
	60.0 µm/m-°C @Temperature 20.0 °C	33.3 µin/in-°F @Temperature 68.0 °F	Alpha 2, as molded
	61.0 µm/m-°C @Temperature 20.0 °C	33.9 µin/in-°F @Temperature 68.0 °F	Alpha 2, 6 hr post cure
Glass Transition Temp, Tg	147 °C	297 °F
	155 °C	311 °F	6 hr post cure
Flammability, UL94	V-0 @Thickness 3.17 mm	V-0 @Thickness 0.125 in
Oxygen Index	32 %	32 %

Processing Properties	Metric	English	Comments
Mold Temperature	175 °C	347 °F
Back Pressure	5.49 - 9.611 MPa	796 - 1394 psi
Cycle Time - Injection	<= 90 sec	<= 90 sec
Cure Time	0.000 - 120 min @Temperature 175 °C	0.000 - 2.00 hour @Temperature 347 °F	Post mold
Gel Time	0.167 min	0.167 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.0670 Month	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.100 Month	0.100 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Cl	<1 ppm
Preheat Temperature	85-95°C
Transfer Time	8-15 seconds

**
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PPLASK019 / 56309

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