Epoxy Potting and Encapsulating Systems for Electronic Applications High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.
Cytec (Conap) RN-1000 / EA-02 Conapoxy® Resin / Conacure® Hardener An unfilled, low viscosity casting system recommended for potting and encapsulating resistors, connectors, solenoids, transformers, coils, and other electrical devices.
- Mix Ratio, Resin/Hardener (by weight): 100/11
Cure Type: Room Temperature Information provided by Cytec, subsequently acquired by Elantas. |