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Master Bond adhesives

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Elantas Conap RN-1000 / EA-02 Conapoxy® Resin / Conacure® Hardener
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes:
Epoxy Potting and Encapsulating Systems for Electronic Applications
High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.

Cytec (Conap) RN-1000 / EA-02 Conapoxy® Resin / Conacure® Hardener
An unfilled, low viscosity casting system recommended for potting and encapsulating resistors, connectors, solenoids, transformers, coils, and other electrical devices.
  • Mix Ratio, Resin/Hardener (by weight): 100/11
Cure Type: Room Temperature

Information provided by Cytec, subsequently acquired by Elantas.

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Physical PropertiesOriginal ValueComments
Viscosity 600 cP
@Temperature 25.0 °C
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 80
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 3.00e+14 ohm-cm
Dielectric Constant 3.5
@Frequency 1000 Hz
Dielectric Strength 350 V/mil
Dissipation Factor 0.0020
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 105 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 24.0 hour
@Temperature 25.0 °C
Pot Life 30.0 min
@Temperature 25.0 °C
100 grams

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PCYTEC29 / 29261

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