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Master Bond adhesives
Rogers Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards
Categories: Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)

Material Notes:
  • Only Woven Glass Reinforced PTFE/Ceramic with Dk of 10.2 or greater
  • High Copper Peel Strength allows for thinner etched line widths
  • Lowest insertion loss available
  • Larger Panel sizes available
  • Low moisture absorption
  • Excellent CTE values lead to high reliability ceramic component attachment and PTH reliability

Benefits:

  • Mechanically strong
  • Greater dimensional stability than other 10 Dk products
  • Circuit miniaturizations leads to weight savings
  • Heat Dissipation and Management
  • Greater signal integrity
  • Cost-effective board layout and board processing
  • Low loss in humid environments

Typical Applications:

  • Ideal for X-band and below
  • Radar modules and manifolds
  • Aircraft Collision Avoidance Systems (TCAS)
  • Ground Based Radar Surveillance Systems
  • Miniaturized Circuitry & Patch Antennas
  • Power Amplifiers (PAs)
  • Low Noise Amplifiers (LNAs)

Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation.

Vendors:
Available Properties
  • Density, ASTM D792 Method A
  • Water Absorption, IPC TM-650 2.6.2.1
  • Outgassing - Total Mass Loss, NASA SP-R-0022A, Water Vapor Recovered
  • Outgassing - Total Mass Loss, NASA SP-R-0022A
  • Collected Volatile Condensable Material, NASA SP-R-0022A
  • Tensile Strength, IPC TM-650 2.4.18.3, Cross
  • Tensile Strength, IPC TM-650 2.4.18.3, Machine
  • Modulus of Elasticity, IPC TM-650 2.4.18.3
  • Flexural Strength, IPC TM-650 2.4.4, Cross
  • Flexural Strength, IPC TM-650 2.4.4, Machine
  • Compressive Modulus, ASTM D3410
  • Poissons Ratio, ASTM D3039
  • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
  • Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
  • Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
  • Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
  • Surface Resistance, IPC TM-650 2.5.17.1, E24/125
  • Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
  • Dielectric Constant, IPC TM-650 2.5.5.5, may vary by thickness
  • Dielectric Strength, IPC TM-650 2.5.6.2
  • Dielectric Breakdown, IPC TM-650 2.5.6
  • Dissipation Factor, IPC TM-650 2.5.5.5, may vary by thickness
  • Arc Resistance, IPC TM-650 2.5.1
  • CTE, linear, IPC TM-650 2.4.41
  • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z direction
  • Thermal Conductivity, ASTM E1461
  • Decomposition Temperature, IPC TM-650 2.4.24.6, 5 percent
  • Decomposition Temperature, IPC TM-650 2.4.24.6, Onset
  • Flammability, UL94
  
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Plastic

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