Rogers Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards

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Rogers Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards
Categories:	Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)
Material Notes:	Only Woven Glass Reinforced PTFE/Ceramic with Dk of 10.2 or greater High Copper Peel Strength allows for thinner etched line widths Lowest insertion loss available Larger Panel sizes available Low moisture absorption Excellent CTE values lead to high reliability ceramic component attachment and PTH reliability Benefits: Mechanically strong Greater dimensional stability than other 10 Dk products Circuit miniaturizations leads to weight savings Heat Dissipation and Management Greater signal integrity Cost-effective board layout and board processing Low loss in humid environments Typical Applications: Ideal for X-band and below Radar modules and manifolds Aircraft Collision Avoidance Systems (TCAS) Ground Based Radar Surveillance Systems Miniaturized Circuitry & Patch Antennas Power Amplifiers (PAs) Low Noise Amplifiers (LNAs) Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation.
Vendors:

Available Properties

Density, ASTM D792 Method A
Water Absorption, IPC TM-650 2.6.2.1
Outgassing - Total Mass Loss, NASA SP-R-0022A, Water Vapor Recovered
Outgassing - Total Mass Loss, NASA SP-R-0022A
Collected Volatile Condensable Material, NASA SP-R-0022A
Tensile Strength, IPC TM-650 2.4.18.3, Cross
Tensile Strength, IPC TM-650 2.4.18.3, Machine
Modulus of Elasticity, IPC TM-650 2.4.18.3
Flexural Strength, IPC TM-650 2.4.4, Cross
Flexural Strength, IPC TM-650 2.4.4, Machine
Compressive Modulus, ASTM D3410
Poissons Ratio, ASTM D3039
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
Surface Resistance, IPC TM-650 2.5.17.1, E24/125
Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
Dielectric Constant, IPC TM-650 2.5.5.5, may vary by thickness
Dielectric Strength, IPC TM-650 2.5.6.2
Dielectric Breakdown, IPC TM-650 2.5.6
Dissipation Factor, IPC TM-650 2.5.5.5, may vary by thickness
Arc Resistance, IPC TM-650 2.5.1
CTE, linear, IPC TM-650 2.4.41
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z direction
Thermal Conductivity, ASTM E1461
Decomposition Temperature, IPC TM-650 2.4.24.6, 5 percent
Decomposition Temperature, IPC TM-650 2.4.24.6, Onset
Flammability, UL94

Property Data

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Category Notes
Plastic

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