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Master Bond adhesives
Rogers Corporation Ultralam® 3850 Liquid Crystalline Polymer Circuit Material
Categories: Polymer

Material Notes: ULTRALAM® 3850 laminate circuit materials utilize highly temperature resistant liquid crystalline polymer (LCP) as the dielectric film.

Features & Benefits:

  • Excellent high frequency properties
  • Stable electrical properties for tightly controlled impedence matching
  • Excellent thickness uniformity for maximum signal integrity
  • Allows use of thinner dielectric layer with minimal signal distortion
  • Good dimensional stability and low modulus
  • Bends easily for flex and conformal applications
  • Offers design flexibility and maximizes circuit density requirements
  • Extremely low moisture absorption
  • Reduced bake times
  • Maintains stable electrical, mechanical and dimensional properties in humid environments
  • Flame Resistant, Halogen free, meets WEEE

Typical Applications:

  • High speed switches and routers
  • Chip packaging
  • MEM's
  • Military satellites and radar sensors
  • Hybrid substrates
  • Handheld and RF devices
  • Base station antennas

Information provided by Rogers Corporation.

Vendors:
Available Properties
  • Density
  • Water Absorption, IPC 2.6.2
  • Thickness, Range of Standard Thicknesses
  • Tensile Strength, IPC 2.4.16
  • Tensile Modulus, IPC 2.4.19
  • Tear Strength Test, kg; IPC 2.4.16
  • Peel Strength, IPC 2.4.8, 1/2 oz. ED foil
  • Volume Resistivity, IPC 2.5.17.1
  • Surface Resistance, IPC 2.5.17.1
  • Dielectric Constant, IPC-TM-650 2.5.5.5.1
  • Dielectric Strength, ASTM D149
  • Dissipation Factor, IPC-TM-650 2.5.5.5.1
  • CTE, linear, IPC 2.4.41.3, X-, Y-Direction
  • CTE, linear, IPC 2.4.41.3, Z-Direction
  • Thermal Conductivity, ASTM C518
  • Melting Point, DSC
  • Maximum Service Temperature, Air, UL RTI
  • UL RTI, Mechanical without Impact
  • Flammability, UL94
  
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Manufacturer Notes:
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Category Notes
Plastic

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