Rogers Corporation Ultralam® 3850 Liquid Crystalline Polymer Circuit Material

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Rogers Corporation Ultralam® 3850 Liquid Crystalline Polymer Circuit Material
Categories:	Polymer
Material Notes:	ULTRALAM® 3850 laminate circuit materials utilize highly temperature resistant liquid crystalline polymer (LCP) as the dielectric film. Features & Benefits: Excellent high frequency properties Stable electrical properties for tightly controlled impedence matching Excellent thickness uniformity for maximum signal integrity Allows use of thinner dielectric layer with minimal signal distortion Good dimensional stability and low modulus Bends easily for flex and conformal applications Offers design flexibility and maximizes circuit density requirements Extremely low moisture absorption Reduced bake times Maintains stable electrical, mechanical and dimensional properties in humid environments Flame Resistant, Halogen free, meets WEEE Typical Applications: High speed switches and routers Chip packaging MEM's Military satellites and radar sensors Hybrid substrates Handheld and RF devices Base station antennas Information provided by Rogers Corporation.
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Physical Properties	Original Value	Comments

Density	1.40 g/cc
Water Absorption	0.040 % @Time 86400 sec	IPC 2.6.2
Thickness	1.00 - 4.00 mil	Range of Standard Thicknesses

Mechanical Properties	Original Value	Comments
Tensile Strength	29000 psi	IPC 2.4.16
Tensile Modulus	327 ksi	IPC 2.4.19
Tear Strength Test	>= 1.4	kg; IPC 2.4.16
Peel Strength	8.52 pli	1/2 oz. ED foil; IPC 2.4.8

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+18 ohm-cm	IPC 2.5.17.1
Surface Resistance	1.00e+16 ohm	IPC 2.5.17.1
Dielectric Constant	2.9 @Frequency 1e+10 Hz	IPC-TM-650 2.5.5.5.1
Dielectric Strength	3500 V/mil	ASTM D149
Dissipation Factor	0.0025 @Frequency 1e+10 Hz	IPC-TM-650 2.5.5.5.1

Thermal Properties	Original Value	Comments
CTE, linear	17.0 µm/m-°C @Temperature 30.0 - 150 °C	X-, Y-Direction; IPC 2.4.41.3
	150 µm/m-°C @Temperature 30.0 - 150 °C	Z-Direction; IPC 2.4.41.3
Thermal Conductivity	0.200 W/m-K	ASTM C518
Melting Point	315 °C	DSC
Maximum Service Temperature, Air	>= 240 °C	UL RTI
UL RTI, Mechanical without Impact	190 °C
Flammability, UL94	V-0

Descriptive Properties
Chemical Resistance	98.7 percent	IPC 2.3.4.2
Coefficient of Hygroscopic Expansion	4 ppm/%RH	60°C
Solder Float	pass	IPC 2.4.13, Method B; 288°C
Thermal Coefficient of Dielectric Constant	24 ppm/°C	IPC 2.5.5.5; 8GHz; -50°C to 150°C

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