TRA-BOND 789-4 one component, thermally conductive adhesive is designed for such applications as substrate attach, sealing micro-electronic packages, heat sink attach, and component staking. This adhesive provides four (4) times more thermal conductivity than unfilled epoxy adhesives. TRA-BOND 789-4 adhesive exhibits strong adhesion to difficult-to-bond metals, such as gold, silver, and copper. It retains its bond strength after exposure to moisture. Information provided by Tra-Con Inc. |