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Chemically Resistant adhesives
Aptek 1301 B/C/B Thermally conductive urethane film adhesive
Categories: Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive

Material Notes: Thermally conductive, electrically insulating hybrid urethane film adhesive
APTEK 1303B/C/B is a low modulus, flexible, void free, electrically insulating hybrid urethane film adhesive designed to bond dissimilar components and substrates. This B/C/B system is designed to manage stresses developed from mismatches of thermal expansion coefficients during temperature cycling as well as to dissipate heat generated from components and circuitry. APTEK 1303 B/C/B technology incorporates a partially-cured (B-staged) adhesive on both faces of a fully-cured (C-staged) ultra low modulus film. APTEK 1303 B/C/B film is a 100% solids, thermoset polymer, which will not outgas, while in place and is suitable for high vacuum environments. The film exhibits outstanding reversion resistance and physical stability under long-term aging of high humidity and heat.

Low modulus/high elongation for minimum stress buildup under components; Low Tg-remains flexible to -75°C; Exceeds NASA outgassing requirements for high vacuum environments; Typical film thickness, .006" to .012". Customer thicknesses available; Available in sheet or die-cut forms; Low tack adhesive layer allows for easy placement and, if needed, repositioning on assemblies

Information provided by Aptek Laboratories, Inc.

Vendors:
Available Properties
  • Density, ASTM D1475
  • Moisture Absorption at Equilibrium, Cured property; ASTM D570
  • Outgassing - Total Mass Loss, Cured property; at 10E-6 torr; ASTM E595
  • Collected Volatile Condensable Material, Cured property; at 10E-6 torr; ASTM E-595
  • Elongation at Break, ASTM D638, Cured
  • Tensile Modulus, ASTM D638
  • Tensile Modulus, ASTM D638
  • Shear Strength, ASTM D1002, Al to Al, 10 mil bondline
  • Volume Resistivity, Cured property; ASTM D257
  • Dielectric Constant, ASTM D150, Cured property
  • Dielectric Strength, ASTM D149, Cured
  • Dissipation Factor, ASTM D150, Cured property
  • CTE, linear, ASTM E831-86, Cured property; alpha 1
  • CTE, linear, ASTM E831-86, Cured property; alpha 2
  • Thermal Conductivity
  • Glass Transition Temp, Tg, Cured property; ASTM E831-86
  • Processing Temperature, Cure 1 hrs
  • Shelf Life, JMTP C-100
  
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Category Notes
Plastic

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Chemically Resistant adhesives
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