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Master Bond adhesives
Reltek BONDiT™ B-521 Adhesive, Sealant & Potting System
Categories: Polymer; Adhesive; Thermoset

Material Notes: Key Properties:
  • Outstanding for bonding dissimilar materials with high thermal expansion differential applications.
  • Fast thermal cure, long pot life.
  • Ease of use.

Applications: Excellent for fast assembly of dissimilar materials with large differentials in thermal expansion, such as glass to acrylic. Bonds most plastics, metals, glass, and ceramics. Cure 10 minutes at 170°F.

Key Words: Epoxy Adhesive, Sealant
Vendors:
Available Properties
  • Viscosity, Thixotropic
  
Property Data

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Manufacturer Notes:
Reltek LLC

Category Notes
Plastic

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