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Master Bond adhesives

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Reltek BONDiT™ B-521 Adhesive, Sealant & Potting System
Categories: Polymer; Adhesive; Thermoset

Material Notes: Key Properties:
  • Outstanding for bonding dissimilar materials with high thermal expansion differential applications.
  • Fast thermal cure, long pot life.
  • Ease of use.

Applications: Excellent for fast assembly of dissimilar materials with large differentials in thermal expansion, such as glass to acrylic. Bonds most plastics, metals, glass, and ceramics. Cure 10 minutes at 170°F.

Key Words: Epoxy Adhesive, Sealant
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Viscosity 2500 cPThixotropic
 
Descriptive Properties
ColorSlight haze

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PAQREL10 / 24226

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