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Rulon Bearings
Henkel Loctite® ECCOBOND FP4450HF Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black

Cure: Heat Cure

Product Benefits:

  • High purity
  • Low stress
  • Good moisture resistance
  • Exhibits relatively high flow
  • High temperature performance
  • Excellent chemical resistance
Application: Encapsulant

Typical Package Application:

  • Automotive applications
  • BGA
  • IC memory cards
  • Chip carriers
  • Hybrid circuits
  • Chip-on-board
  • Multi-chip modules
  • Pin grid arrays
LOCTITE ECCOBOND FP4450 encapsulant is designed for protection of bare semiconductor devices. It offers pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control.

Information provided by Loctite®

Vendors:
Available Properties
  • Specific Gravity
  • Filler Content
  • Particle Size
  • Brookfield Viscosity, Spindle 6, speed 20 rpm
  • CTE, linear, Cured, Below Tg
  • CTE, linear, Cured, Above Tg
  • Thermal Conductivity, Cured
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Glass Transition Temp, Tg, Cured, by TMA
  • Cure Time
  • Cure Time, plus 3 hours @ 165°C, Alternative Cure Schedule
  • Cure Time
  • Gel Time
  • Shelf Life, from date of manufacture
  
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Manufacturer Notes:
Loctite Division of Henkel

Category Notes
Plastic

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Ensinger PEI
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